MicroStrain 3DM-CV5-AR, By HBK (USA)

Specifications
Model:
3DM-CV5-AR
Maker/Brand:
HBK
Category:
Notes:

The MicroStrain 3DM®CV5-AR is the smallest and lightest industrial attitude reference available. It features a fully calibrated and temperature compensated triaxial accelerometer and gyroscope to achieve the optimum combination of measurement qualities under all dynamic conditions.

The 3DM-CV5-AR is designed to balance cost and performance, and is ideally suited for a wide range of applications, including platform stabilization, balancing robots, antenna pointing, and usage monitoring.

Sensor

  • High Performance Accelerometer
    • 100 µg/√Hz (8g standard)
    • 2g, 4g, 20g, 40g options
  • Super-stable Gyro
    • 8 dph in-run bias (-40 to +85°C)
    • Offset temperature hysteresis 0.05°/s
    • ARW 0.3°/√hr

Operation

  • IMU sampling rate up to 1000Hz
  • Auto-adaptive EKF output rate up to 500Hz
  • Independently configurable IMU and EKF outputs
  • Forward compatible MIP Protocol optimizes bandwidth
  • SensorConnect software for configuration, control, display, and logging

Package

  • CNC Anodized Aluminum
  • Precision alignment features
  • Highly compact and low profile
    • 38.0 mm x 24.0 mm x 9.7 mm
    • 11.0 grams
  • TTL UART interface (up to 921600 BAUD)
  • –40 to +85 °C operating temperature range

The 3DM-CV5 family of industrial-grade, board-level inertial sensors provides a wide range of triaxial inertial measurements, computed attitude, and navigation solutions.

The Inertial Measurement Unit (IMU) includes direct measurement of acceleration, angular rate, Delta-theta, and Delta-velocity. Compensation options include automatic compensation for magnetic anomalies, gyro and accelerometer noise, and noise effects. In models that include computed outputs, sensor measurements are processed through and auto-adaptive estimation filter algorithm to produce high accuracy computed outputs under dynamic conditions. The computed outputs vary between models and can include roll, pitch, and yaw. All sensors are fully temperature-compensated and calibrated over the operating temperature. Micro-Electro-Mechanical Systems (MEMS) technology allows for highly accurate, small, lightweight devices.

SensorConnect software is a user friendly program for device configuration. MIP Monitor (MicroStrain Inertial Protocol) can also be used. Both packages provide for device configuration, live data monitoring, and recording. Alternatively, the MIP Data Communications Protocol is available for development of custom interfaces and easy OEM integration.

The sensor operates independent of computer platform, operating system, or coding language.